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  • Apple debuts iPhone Duo 📱, TSMC plans High-NA EUV 🔬, Google goes nuclear ☢️

    From TLDR Hardware@VERT to All on Fri Sep 11 13:28:22 2026
    New CEO John Ternus led his first keynote, headlined by the iPhone
    Duo, Apple's first foldable, a passport-style device with a 5.4-inch
    outer display ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌  ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ ‌ 


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    TLDR

    TLDR HARDWARE 2026-09-11

    📱

    HEADLINES AND LAUNCHES

    APPLE DEBUTS IPHONE DUO, ITS FIRST FOLDABLE, AT $1,999 (5 MINUTE
    READ) [4]

    New CEO John Ternus led his first keynote, headlined by the iPhone
    Duo, Apple's first foldable, a passport-style device with a 5.4-inch
    outer display and a 7.6-inch inner display that automatically reflows
    apps based on how the phone is folded, starting at $1,999. Apple also
    unveiled the iPhone 18 Pro and Pro Max ($1,199/$1,299, up $100 from
    last year) with new A20 Pro processors, a variable mechanical aperture
    camera, and 24-30 hour battery life, alongside the Apple Watch Series
    12 and Ultra 4, which add a 5-second heart rate sensor Apple claims is
    more accurate than a chest strap.

    OPENAI MAY DOUBLE-SOURCE NEXT-GEN AI CHIPS AT SAMSUNG, ALONGSIDE TSMC
    (3 MINUTE READ) [5]

    OpenAI Korea GM Harrison Kim revealed the company has made real
    progress with Samsung Electronics on joint production and research for
    its next-generation chips, expanding a relationship that so far has
    been mostly about memory supply and enterprise software. OpenAI's
    current inference ASIC, Jalapeño, was designed with Broadcom and
    built at TSMC in under 18 months and is already in mass production
    there, so any Samsung involvement more plausibly targets its
    successor, which is reportedly approaching tapeout.

    🔨

    ENGINEERING AND APPLICATIONS

    TSMC'S AUGUST REVENUE JUMPS 53% TO A RECORD HIGH, PLANS HIGH-NA EUV
    ADOPTION FOR 2030 (3 MINUTE READ) [6]

    TSMC posted NT$514.8 billion ($16.1 billion) in August revenue, up
    53.3% year-over-year and 10.1% from July, hitting a fresh monthly
    record as AI-driven chip demand keeps outpacing supply. It came
    alongside a separate announcement with Dutch equipment maker ASML:
    TSMC plans to bring ASML's High-NA EUV lithography into large-scale manufacturing starting in 2030 for its most advanced nodes, as AI
    accelerators push toward increasingly complex transistor
    architectures.

    INTRODUCING CUDA RUST FOR HIGH-PERFORMANCE GPU KERNEL DEVELOPMENT (5
    MINUTE READ) [7]

    NVIDIA has announced CUDA Rust and introduced two specialized
    compilation tracks that allow developers to author and optimize GPU
    compute kernels directly in Rust. This release brings Rust's strong compile-time memory safety guarantees and modern tooling ecosystem to GPU-accelerated workloads. Developers implementing embedded vision,
    intensive sensor fusion, and real-time state estimation on mobile
    platforms can now exploit GPU compute power while minimizing
    memory-related crashes and runtime concurrency bugs.

    🧠

    RESEARCH AND PROTOTYPES

    VLLM TRIPLES MINIMAX M3 INFERENCE THROUGHPUT ON AMD'S MI355X THROUGH SYSTEMATIC BOTTLENECK CHASING (6 MINUTE READ) [8]

    AMD and Embedded LLM teams took MiniMax M3's day-0 vLLM
    implementation from 109.1 to 342.4 output tokens/s/GPU on AMD's
    Instinct MI355X, a 3.14x gain, by repeatedly asking five questions as
    the bottleneck kept shifting: what local shape reached each rank after tensor-parallel sharding, what work repeats every layer, which bytes
    actually move, whether a claimed fast path actually executed, and
    which queue grows once kernels stop being the limiter. Big wins came
    from fusing the model's shared expert into the same grouped GEMMs as
    routed experts (up to 30% faster at low concurrency), and reusing sparse-attention block selections across adjacent layers instead of
    recomputing per layer.

    BESXAR FLIES FIRST SUBORBITAL SEMICONDUCTOR MANUFACTURING DEMO,
    BANKING ON FREE VACUUM IN SPACE (2 MINUTE READ) [9]

    Besxar, a $9.35 million seed-funded startup, flew its first mission
    on July 5 aboard a SpaceX Falcon 9 alongside a Starlink batch,
    carrying its own semiconductor wafers plus test wafers from the
    University of Virginia and UT Austin. The company's pitch is simple: Earth-based fabs spend billions on pumps to create the vacuum
    semiconductors need, but in space vacuum is free, so Besxar wants to manufacture higher-quality, lower-cost wafers in orbit and return them
    to Earth to sell.

    🎁

    MISCELLANEOUS

    GOOGLE COMMITS $15B TO FINLAND DATA CENTERS, EXPLORES NUCLEAR POWER
    FOR THE BUILDOUT (3 MINUTE READ) [10]

    Google plans to invest at least $15 billion in Finnish AI
    infrastructure through 2028, its largest single investment in Europe,
    building on over 15 years of presence there. Alongside the buildout,
    Google signed a 22-year power agreement with Finnish utility Fortum
    and said it will explore business models that could support new
    nuclear reactors at Fortum's Loviisa site, tying the compute expansion
    directly to a long-term power source.

    LG DENIES CLAIMS ITS SMART TVS CONSTANTLY RECORD AND UPLOAD AUDIO (4
    MINUTE READ) [11]

    Gamers Nexus published a two-hour investigation, done with security researchers MrBruh and uturn using packet capture and firmware
    analysis, alleging LG's smart TVs constantly log and upload user data
    even offline or in standby, scan local Wi-Fi networks for other
    devices, and record and store ambient audio through the TV's
    microphone for later retrieval, even when the TV appears off. LG
    called the claims untrue, saying its TVs only process voice data when
    the remote's voice button is pressed or its "Hi LG" wake word is
    detected after a user manually enables far-field voice recognition,
    with wake-word audio processed entirely on-device and deleted
    immediately if no match is found.

    ⚡

    QUICK LINKS

    XPENG'S IRON HUMANOID WALKS OFF ITS NEW AUTOMOTIVE-GRADE PRODUCTION
    LINE (3 MINUTE READ) [12]

    XPENG commissioned its humanoid robot production lines, and its IRON
    robot autonomously walked off them after completing assembly, a step
    the company frames as moving from R&D prototypes to real line
    manufacturing.

    HUAWEI AND CAMBRICON HIKE AI CHIP PRICES 20-50% AS HBM SHORTAGE
    FORCES GREY-MARKET BUYING (3 MINUTE READ) [13]

    Chinese AI chipmakers, including Huawei and Cambricon, have sharply
    raised prices for current and next-gen processors.

    COVENANT UNVEILS ANTHEM, A HEAVY-PAYLOAD STRIKE MISSILE BUILT TO BE MASS-PRODUCED ACROSS THREE COUNTRIES (3 MINUTE READ) [14]

    Anthem is a long-range precision strike weapon aimed at a gap
    Covenant argues current Western arsenals lack.

    ANALOG DEVICES PAYS $1.35B FOR EDGE AI CHIPMAKER ALIF SEMICONDUCTOR
    (4 MINUTE READ) [15]

    Analog Devices agreed to buy Alif Semiconductor for $1.35 billion
    cash plus up to $200 million contingent on performance, adding
    microcontrollers built to run neural networks directly on-device
    rather than sending data to a data center.

    JD.COM PLANS 3 MILLION ROBOTS AND A 100,000-ACCELERATOR PHYSICAL AI
    CLUSTER (5 MINUTE READ) [16]

    JD Logistics plans to procure 3 million robots, 1 million autonomous
    vehicles, and 100,000 delivery drones over five years to automate
    picking, sorting, transport, and last-mile delivery.

    VENTION OPENS A PHYSICAL AI LAB TIED DIRECTLY TO THOUSANDS OF
    FACTORIES (5 MINUTE READ) [17]

    Vention opened a Montreal lab focused on robotic manipulation,
    industrial data collection, and post-training robotics foundation
    models using learning-from-demonstration, reinforcement learning,
    vision models, and motion planning.

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    Thanks for reading,
    Kshitij Sudan [22] & Adi Nikumbh [23]

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    [5] https://www.tomshardware.com/tech-industry/artificial-intelligence/openai-says-its-next-generation-processors-could-be-made-at-samsung-double-sourcing-with-tsmc-hints-at-massive-volume-requirements?utm_source=tldrhardware
    [6] https://www.cnbc.com/2026/09/10/tsmc-august-revenue-chip-ai.html?utm_source=tldrhardware
    [7] https://developer.nvidia.com/blog/introducing-cuda-rust-two-tracks-for-writing-gpu-kernels/?utm_source=tldrhardware
    [8] https://vllm.ai/blog/2026-09-10-minimax-m3-mi355x?utm_source=tldrhardware [9] https://payloadspace.com/besxar-flies-suborbital-semiconductor-demo?utm_source=tldrhardware
    [10] https://www.cnbc.com/2026/09/09/google-finland-ai-infrastructure-investment.html?utm_source=tldrhardware
    [11] https://www.tomshardware.com/tech-industry/big-tech/lg-strongly-denies-tv-security-claims-says-tracking-and-snooping-concerns-not-true-online-investigation-claims-216-000-000-spy-tvs-record-audio?utm_source=tldrhardware
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    [16] https://www.scmp.com/tech/big-tech/article/3366884/jdcom-deploy-3-million-robots-fully-automate-logistics?utm_source=tldrhardware
    [17] https://www.prnewswire.com/news-releases/vention-opens-physical-ai-lab-to-bridge-ai-research-and-scalable-industrial-deployment-302872841.html?utm_source=tldrhardware
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